Owner's Manual
Table Of Contents
- Owner's Manual
- Service Manual
- Table of Contents
- Safety Precautions
- Warning
- Specifications
- Location of Controls and Components
- Troubleshooting Guide
- Disassembly and Assembly Instructions
- Types of Screws
- Disassembly Flow Chart
- Main Components and P.C.B. Locations
- Disassembly of T/T Rubber Matand Turntable Ass’y
- Disassembly of Insulator Unit
- Disassembly of Bottom Chassis Ass’y
- Disassembly of DC Motors
- Disassembly of Phono Out P.C.B.
- Disassembly of Tone Arm All Unit Ass’y, Queuing Knob and Armrest Ass’y
- Disassembly of Main P.C.B.
- Disassembly of SMPS P.C.B.
- Disassembly of Panel P.C.B.
- Measurements and Adjustments
- Block Diagram
- Wiring Connection Diagram
- Exploded View and Replacement Parts List
5
2Warning
2.1. Prevention of Electrostatic Discharge (ESD) to Electrostatically Sensi-
tive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called Elec-
trostatically Sensitive (ES) Devices.
The following techniques should be used to help reduce the incidence of component damage caused by electrostatic discharge
(ESD).
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as alumi-
num foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can
generate electrical charge sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or compara-
ble conductive material).
7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
CAUTION:
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) suf-
ficient to damage an ES device).
2.2. General description about Lead Free Solder (PbF)
The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this
equipment in considering the globally environmental conservation.
The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin
(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that
of the normal solder.
Definition of PCB Lead Free Solder being used
The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.
(See right figure)