Datasheet

Mini- Universal MATE- N- LOK Splash- Proof Sealed Connectors
114- 13089
Rev B 13 of 20Tyco Electronics Corporation
Figure 11
3.30 [.130] Min
Allowable Distance
Right--Angle Pin Header
3.30 [.130] Min
Allowable Distance
Vertical Pin Header
Contact
Cavities (Ref)
Contact
Cavities (Ref)
3.12. Pin Header Placement
Pin headers should be handled only by the housing to avoid deformation, contamination, or damage to the contact
solder tails.
The pin header number one position must be aligned with the number one position pc board hole. When
placing pin headers on the pc board, the contact solder tails and boardlock must be aligned and started into
their matching holes before seating the pin header onto the pc board. After seating, the shoulder of the
boardlock must be through the pc board, and the standoffs must be seated on the pc board. See Figure 12.
Figure 12
Standoffs Seated
on PC Board
Right--Angle Pin Header Vertical Pin Header
Shoulder of Boardlock
Through PC Board
Shoulder of Boardlock
Through PC Board
Standoffs Seated
on PC Board
3.13. Soldering
Observe guidelines and procedures when soldering header assembly contacts. All solder joints should conform
to those specified in Workmanship Specification 101--21 and all other requirements specified in this document.
Solder , clean, and dry all wire leads to contacts according to the following:
A. Flux Selection
Contacts must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will
depend on the type of pc board and other components mounted on the board. Additionally, the flux must
be compatible with the wave solder line, manufacturing, health, and safety requirements. Call PRODUCT
INFO at the number at the bottom of page 1 for consideration of other types of flux. Flux that is compatible
with these connectors is provided in Figure 13.
F
L
U
X
T
Y
P
E
A
C
T
I
V
I
T
Y
R
E
S
I
D
U
E
COMMERCIAL DESIGNATION
FLUX T
Y
PE ACTIVIT
Y
RESIDUE
KESTER ALPHA
RMA Mild Noncorrosive 186 611
Figure 13
CAUTION
!