Datasheet

Mini- Universal MATE- N- LOK Splash- Proof Sealed Connectors
114- 13089
Rev B 11 of 20Tyco Electronics Corporation
3.11. PC Board
A. Material and Thickness
The pc board material shall be glass epoxy (FR--4 or G--10). The pc board thickness range shall be 1.57 to
2.36 mm [.062 to .093 in.].
B. Pads
The pc board circuit pads must be solderable in accordance with Test Specification 109--11.
C. Hole Dimensions
The contact holes must be drilled and plated through to specific dimensions to prevent stubbing during
placement of the pin headers on the pc board. The drilled hole size, plating types, and plating thickness
are dependent on the application requirements. The boardlock hole may be used with or without plated
holes. The finished hole size must be as stated to provide unrestricted insertion. See Figure 9.
“A” (Refer to Table)
Drilled Hole Diameter
Contact Hole Boardlock Hole
Drilled Hole Diameter
(Ref)
1.40+
0.08 [.055+.003]
Finished Hole Diameter
After Plating
Trace Width
(As Required)
.051+.025 [.002+.001]
Copper Plating (Max Hardness 150 Knoop)
0.008 [.0003] (Min)
Tin--Lead Plating
DIMENSION A
Vertical Pin Header Right--Angle Pin Header
3.18+0.05 [.125+.002] 3.86+0.05 [.152+.002]
Figure 9