Datasheet

Advance Data Sheet: iAF Series – Non-isolated SMT Power Module
©2011 TDK Innoveta Inc.
iAF12_Full_Datasheet_10032012.doc 10/3/2012
℡
(877) 498
-
0099
2/18
Ordering information:
Product
Identifier
Package Size Platform Input
Voltage
Output
Current/
Power
Units Main
Output
Voltage
# of
Outputs
Safety
Class
Feature Set RoHS
Indicator
i A F 12 020 A 007 V - 0 06 - R
TDK
Innoveta
33mm x
13.5mm
iAF
4.5V to
14V
20
Amps
0.70V to
5.5V
Single
See option
table
R=RoHS 6
Compliant
Option Table:
Feature Set
Positive
Logic On/Off
Negative
Logic On/Off
Sequence
LGA Solder
Bumping*
EPC Solder
Bumping*
Product Label
Marking
00 X X x -000
01 X X x -001
02 X x -002
03 X x -003
04 X X x -004
05 X X x -005
06 X x -006
07 X x -007
* LGA solder bumping option is recommended for customers using the DOSA standard land grid array
footprint and EPC soldering bumping is recommended for customers using the inspectable edge plated
castellation pads
Product Offering:
Code Input Voltage Output Voltage Output Current
Maximum
Output Power
Efficiency
iAF12020A007V 4.5V-14V 0.70V-5.5V 20A
110W
95%
3320 Matrix Drive, Suite 100
Richardson, TX 75802
Phone [phone] Toll Free
[phone]
Fax [phone] Toll Free
[phone]
[e-mail]
http://www.tdkinnoveta.com/