Integration Manual

TOBY-L3 series - System Integration Manual
TSD-19090601 - R13 Page 5 of 143
2.6.4 DDC (I2C) interfaces ..................................................................................................................................................... 102
2.6.5 SDIO interface ................................................................................................................................................................. 108
2.6.6 SGMII interface ............................................................................................................................................................... 111
2.7 eMMC interface ........................................................................................................................................................................ 112
2.7.1 Guidelines for eMMC circuit design ..................................................................................................................... 112
2.7.2 Guidelines for eMMC layout design .................................................................................................................... 112
2.8 Digital Audio interface .......................................................................................................................................................... 113
2.8.1 Guidelines for digital audio circuit design ........................................................................................................ 113
2.8.2 Guidelines for digital audio layout design ........................................................................................................ 116
2.9 ADC interfaces .......................................................................................................................................................................... 116
2.9.1 Guidelines for ADC circuit design ......................................................................................................................... 116
2.9.2 Guidelines for ADC layout design ......................................................................................................................... 117
2.10 General Purpose Input/Output ......................................................................................................................................... 117
2.10.1 Guidelines for GPIO circuit design ........................................................................................................................ 117
2.10.2 Guidelines for general purpose input/output layout design ................................................................... 118
2.11 Reserved pins (RSVD) ............................................................................................................................................................ 118
2.12 Module placement .................................................................................................................................................................. 118
2.13 Module footprint and paste mask .................................................................................................................................. 119
2.14 Thermal guidelines ................................................................................................................................................................. 120
2.15 Design-in checklist .................................................................................................................................................................. 121
2.15.1 Schematic checklist ...................................................................................................................................................... 121
2.15.2 Layout checklist .............................................................................................................................................................. 122
2.15.3 Antenna checklist .......................................................................................................................................................... 123
3 Handling and soldering ................................................................................................................ 125
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................................. 125
3.2 Handling ...................................................................................................................................................................................... 125
3.3 Soldering ..................................................................................................................................................................................... 126
3.3.1 Soldering paste .............................................................................................................................................................. 126
3.3.2 Reflow soldering ............................................................................................................................................................ 126
3.3.3 Optical inspection ......................................................................................................................................................... 128
3.3.4 Cleaning ............................................................................................................................................................................. 128
3.3.5 Repeated reflow soldering ........................................................................................................................................ 128