Integration Manual

TOBY-L3 series - System Integration Manual
TSD-19090601 - R13 System Integration Manual Page 128 of 143
Preheat Heating Cooling
[°C] Peak Temp. 245°C [°C]
250 250
Liquidus Temperature
217 217
200 200
40 - 60 s
End Temp.
max 4°C/s
150 - 200°C
150 150
max 3°C/s
60 - 120 s
100 Typical Leadfree 100
Soldering Profile
50 50
Elapsed time [s]
Figure 60: Recommended soldering profile
☞ The modules must not be soldered with a damp heat process.
3.3.3 Optical inspection
After soldering the module, inspect it optically to verify that it is properly aligned and centered.
3.3.4 Cleaning
Cleaning the modules is not recommended. Residues underneath the modules cannot be easily removed
with a washing process.
 Cleaning with water will lead to capillary effects where water is absorbed in the gap between the
baseboard and the module. The combination of residues of soldering flux and encapsulated water leads
to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the
sticker and the ink-jet printed text.
 Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the
two housings, areas that are not accessible for post-wash inspections. The solvent will also damage the
sticker and the ink-jet printed text.
 Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators.
For best results, use a "no clean" soldering paste and eliminate the cleaning step after the soldering.
3.3.5 Repeated reflow soldering
Repeated reflow soldering processes and soldering the module upside down are not recommended.
Boards with components on both sides may require two reflow cycles. In this case, the module should
always be placed on the side of the board that is submitted into the last reflow cycle. The reason for this