Integration Manual
Table Of Contents
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC)
- 1.5.1.1 VCC supply requirements
- 1.5.1.2 VCC current consumption in 2G connected mode
- 1.5.1.3 VCC current consumption in 3G connected mode
- 1.5.1.4 VCC current consumption in LTE connected mode
- 1.5.1.5 VCC current consumption in cyclic low power idle mode / active mode
- 1.5.1.6 VCC current consumption in fixed active mode
- 1.5.2 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC)
- 1.6 System function interfaces
- 1.7 Antenna interfaces
- 1.8 SIM interfaces
- 1.9 Data communication interfaces
- 1.10 eMMC interface
- 1.11 Digital Audio interfaces
- 1.12 ADC interfaces
- 1.13 General Purpose Input/Output
- 1.14 Reserved pins (RSVD)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Jamming detection
- 1.15.3 IP modes of operation
- 1.15.4 Dual stack IPv4 and IPv6
- 1.15.5 Embedded TCP/IP and UDP/IP
- 1.15.6 Embedded FTP and FTPS
- 1.15.7 Embedded HTTP and HTTPS
- 1.15.8 SSL and TLS
- 1.15.9 Firmware update Over AT (FOAT)
- 1.15.10 Firmware update Over The Air (FOTA)
- 1.15.11 Power Saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC)
- 2.2.1.1 General guidelines for VCC supply circuit selection and design
- 2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC supply circuit design using a LDO linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary battery
- 2.2.1.6 Additional guidelines for VCC supply circuit design
- 2.2.1.7 Guidelines for the external battery charging circuit
- 2.2.1.8 Guidelines for external charging and power path management circuit
- 2.2.1.9 Guidelines for removing VCC supply
- 2.2.1.10 Guidelines for VCC supply layout design
- 2.2.1.11 Guidelines for grounding layout design
- 2.2.2 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interfaces
- 2.6 Data communication interfaces
- 2.7 eMMC interface
- 2.8 Digital Audio interface
- 2.9 ADC interfaces
- 2.10 General Purpose Input/Output
- 2.11 Reserved pins (RSVD)
- 2.12 Module placement
- 2.13 Module footprint and paste mask
- 2.14 Thermal guidelines
- 2.15 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 5 Product testing
- 6 FCC Notes
- Appendix
- Glossary
- Related documents
- Revision history
- Contact
TOBY-L3 series - System Integration Manual
TSD-19090601 - R13 System Integration Manual Page 125 of 143
3 Handling and soldering
☞ No natural rubbers, no hygroscopic materials or materials containing asbestos are employed.
3.1 Packaging, shipping, storage and moisture preconditioning
For information about the TOBY-L3 series reels / tapes, Moisture Sensitivity levels (MSD), shipment and
storage information, as well as drying for preconditioning, see the TOBY-L3 series Data Sheet [1].
3.2 Handling
The TOBY-L3 series modules are Electro-Static Discharge (ESD) sensitive devices.
⚠ Ensure ESD precautions are implemented during handling of the module.
Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between two objects
at different electrical potentials caused by direct contact or induced by an electrostatic field. The term is
usually used in the electronics and other industries to describe momentary unwanted currents that may
cause damage to electronic equipment.
The ESD sensitivity for each pin of TOBY-L3 series modules (as Human Body Model according to JESD22-
A114F) is specified in the TOBY-L3 series Data Sheet [1].
ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a small
working station or a large manufacturing area. The main principle of an EPA is that there are no highly
charging materials near ESD sensitive electronics, all conductive materials are grounded, workers are
grounded, and charge build-up on ESD sensitive electronics is prevented. International standards are used
to define typical EPA and can be obtained for example from International Electrotechnical Commission (IEC)
or American National Standards Institute (ANSI).
In addition to standard ESD safety practices, the following measures should be taken into account whenever
handling the TOBY-L3 series modules:
Unless there is a galvanic coupling between the local GND (i.e. the work table) and the PCB GND, then
the first point of contact when handling the PCB must always be between the local GND and PCB GND.
Before mounting an antenna patch, connect the ground of the device.
When handling the module, do not come into contact with any charged capacitors and be careful when
contacting materials that can develop charges (e.g. patch antenna, coax cable, soldering iron).