Integration Manual
Table Of Contents
- Contents
- 1 System description
- 1.1 Overview
- 1.2 Architecture
- 1.3 Pin-out
- 1.4 Operating modes
- 1.5 Supply interfaces
- 1.5.1 Module supply input (VCC)
- 1.5.1.1 VCC supply requirements
- 1.5.1.2 VCC current consumption in 2G connected mode
- 1.5.1.3 VCC current consumption in 3G connected mode
- 1.5.1.4 VCC current consumption in LTE connected mode
- 1.5.1.5 VCC current consumption in cyclic low power idle mode / active mode
- 1.5.1.6 VCC current consumption in fixed active mode
- 1.5.2 Generic digital interfaces supply output (V_INT)
- 1.5.1 Module supply input (VCC)
- 1.6 System function interfaces
- 1.7 Antenna interfaces
- 1.8 SIM interfaces
- 1.9 Data communication interfaces
- 1.10 eMMC interface
- 1.11 Digital Audio interfaces
- 1.12 ADC interfaces
- 1.13 General Purpose Input/Output
- 1.14 Reserved pins (RSVD)
- 1.15 System features
- 1.15.1 Network indication
- 1.15.2 Jamming detection
- 1.15.3 IP modes of operation
- 1.15.4 Dual stack IPv4 and IPv6
- 1.15.5 Embedded TCP/IP and UDP/IP
- 1.15.6 Embedded FTP and FTPS
- 1.15.7 Embedded HTTP and HTTPS
- 1.15.8 SSL and TLS
- 1.15.9 Firmware update Over AT (FOAT)
- 1.15.10 Firmware update Over The Air (FOTA)
- 1.15.11 Power Saving
- 2 Design-in
- 2.1 Overview
- 2.2 Supply interfaces
- 2.2.1 Module supply (VCC)
- 2.2.1.1 General guidelines for VCC supply circuit selection and design
- 2.2.1.2 Guidelines for VCC supply circuit design using a switching regulator
- 2.2.1.3 Guidelines for VCC supply circuit design using a LDO linear regulator
- 2.2.1.4 Guidelines for VCC supply circuit design using a rechargeable battery
- 2.2.1.5 Guidelines for VCC supply circuit design using a primary battery
- 2.2.1.6 Additional guidelines for VCC supply circuit design
- 2.2.1.7 Guidelines for the external battery charging circuit
- 2.2.1.8 Guidelines for external charging and power path management circuit
- 2.2.1.9 Guidelines for removing VCC supply
- 2.2.1.10 Guidelines for VCC supply layout design
- 2.2.1.11 Guidelines for grounding layout design
- 2.2.2 Generic digital interfaces supply output (V_INT)
- 2.2.1 Module supply (VCC)
- 2.3 System functions interfaces
- 2.4 Antenna interface
- 2.5 SIM interfaces
- 2.6 Data communication interfaces
- 2.7 eMMC interface
- 2.8 Digital Audio interface
- 2.9 ADC interfaces
- 2.10 General Purpose Input/Output
- 2.11 Reserved pins (RSVD)
- 2.12 Module placement
- 2.13 Module footprint and paste mask
- 2.14 Thermal guidelines
- 2.15 Design-in checklist
- 3 Handling and soldering
- 4 Approvals
- 5 Product testing
- 6 FCC Notes
- Appendix
- Glossary
- Related documents
- Revision history
- Contact
TOBY-L3 series - System Integration Manual
TSD-19090601 - R13 System Integration Manual Page 123 of 143
Check 50 nominal characteristic impedance of the RF transmission line connected to the ANT1
and the ANT2 ports (antenna RF interfaces).
Ensure no coupling occurs between the RF interface and noisy or sensitive signals (SIM signals,
high-speed digital lines such as the USB, SDIO, SGMII, eMMC, SPI and other data lines).
Optimize placement for minimum length of the RF line.
Check the footprint (copper mask), solder resist mask and stencil (paste mask) designed for TOBY-
L3 series modules as shown in section 2.13.
VCC line should be as wide and as short as possible.
Route VCC supply line away from RF lines / parts and other sensitive analog lines / parts.
The VCC bypass capacitors in the picoFarad range should be placed as close as possible to the VCC
pins, in particular if the application device integrates an internal antenna.
Ensure an optimal grounding connecting each GND pin with the application board solid ground
layer.
Use as many vias as possible to connect the ground planes on a multilayer application board,
providing a dense line of vias at the edges of each ground area, in particular along the RF and high
speed lines.
Keep routing short and minimize parasitic capacitance on the SIM lines to preserve signal integrity.
USB 2.0 data line traces must meet characteristic impedance requirements as per USB 2.0
specification [4], and should not be routed close to any RF line / part.
Keep the SDIO traces short, avoid stubs, avoid coupling with any RF line / part and consider low
value series damping resistors to avoid reflections and other losses in signal integrity.
Ensure appropriate RF precautions for the Wi-Fi and Cellular technologies coexistence.
Ensure appropriate RF precautions for the GNSS and Cellular technologies coexistence.
Route digital audio signals away from noisy sources (primarily RF interface, VCC, switching supplies).
The audio outputs lines on the application board must be wide enough to minimize series resistance.
2.15.3 Antenna checklist
Antenna termination should provide a 50 characteristic impedance with VSWR at least less than
3:1 (recommended 2:1) on operating bands in the deployment geographical area.
Follow the recommendations of the antenna producer for correct antenna installation and
deployment (PCB layout and matching circuitry).
Ensure compliance with any regulatory agency RF radiation requirement.
Ensure high and similar efficiency for both the primary (ANT1) and the secondary (ANT2) antennas.
Ensure high isolation between the primary (ANT1) and the secondary (ANT2) antennas.