Integration Manual

TOBY-L3 series - System Integration Manual
TSD-19090601 - R13 System Integration Manual Page 119 of 143
2.13 Module footprint and paste mask
Figure 59 and Table 46 describe the suggested footprint (i.e. copper mask) and the paste mask (i.e. stencil)
layout for TOBY-L3 series modules, to be implemented on the application PCB.
The proposed land pattern layout (i.e. the footprint, the application board top-layer copper mask) reflects
the modules’ pads layout, with the pads on the application board designed as the LGA pads of the module.
I
A
D
F
K
M1
M1
M2
P2
B
G1 HJ
L N
M1
M1
M3
II OJJ J
E
P3
F
P1
H
O
M1
H
G2G2
G1
H
J
I
H
O
O
0.80
1.50
1.45
0.60
0.10
0.17
Copper
Past e
1.10
1.10
1.00
1.00
0.05
0.05
Past e
Copper
1.10
1.10
0.90
0.90
0.10
0.10
Past e
Copper
0.80
1.50
1.38
0.60
0.10
0.06
Past e
Copper
Figure 59: Suggested footprint and stencil design for TOBY-L3 modules, to be implemented on application PCB (top view)
Parameter
Value
Parameter
Value
Parameter
Value
Parameter
Value
A
35.6 mm
G1
1.10 mm
K
3.15 mm
N
2.10 mm
B
24.8 mm
G2
2.00 mm
L
7.15 mm
O
1.10 mm
D
2.40 mm
H
0.80 mm
M1
1.80 mm
P1
1.10 mm
E
2.25 mm
I
1.50 mm
M2
3.40 mm
P2
1.25 mm
F
1.45 mm
J
0.30 mm
M3
2.25 mm
P3
2.85 mm
Table 46: Suggested footprint design dimensions for TOBY-L3 series modules, to be implemented on application PCB
Non Solder resist Mask Defined pad type is recommended over Solder resist Mask Defined type, designing
the solder resist mask opening 50 µm larger per side than the corresponding copper pad.
The suggested paste mask (i.e. stencil) layout to mount the modules on the application PCB is also illustrated
in Figure 59. Different stencil apertures layout for any specific pad is recommended:
 Green marked pads: Paste layout enlarged on the lateral side and reduced on other sides
 Light-Green marked pads: Paste layout reduced circumferentially to Copper layout
 Blue marked pads: Paste layout reduced circumferentially 0.05 mm to Copper layout