Datasheet

SK32B – SK320B
Taiwan Semiconductor
7 Version: P2212
PACKAGE OUTLINE DIMENSIONS
DO-214AA (SMB)
SUGGESTED PAD
LAYOUT
4.20
2.60
2.00
4.60
4.05
5.60
5.10
0.13 C A B
3.95
3.30
A
B
2.20
1.94
0.13 C A B
C
H
1.60
0.75
0.31
0.15
2.65
1.95
2.45
1.90
0.20
0.05
C
H
NOTES: UNLESS OTHERWISE SPECIFIED
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M-1994.
3. PACKAGE OUTLINE REFERENCE:
JEDEC DO-214, VARIATION AA, ISSUE D.
4 MOLDED PLASTIC BODY DIMENSIONS DO NOT
INCLUDE MOLD FLASH.
5 MOLDED PLASTIC BODY LATERAL DIMENSIONS
TO BE DETERMINED AT DATUM PLANE H.
6. DWG NO. REF: HQ2SD07-DO214SMB-035 REV A.
DETAIL A
SEATING
PLANE
DETAIL A, ROTATED -90°
(SCALE 2:1)
P/N = MARKING CODE
G = GREEN COMPOUND
YW = DATE CODE
F = FACTORY CODE
MARKING DIAGRAM
CATHODE
INDICATOR
GYWF
P/N
4
5
4
5