Datasheet

S1DAL – S1MAL
Taiwan Semiconductor
2 Version: B2103
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TYP
UNIT
Junction-to-lead thermal resistance
R
ӨJL
29
°C/W
Junction-to-ambient thermal resistance
R
ӨJA
82
°C/W
Junction-to-case thermal resistance
R
ӨJC
30
°C/W
Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board)
ELECTRICAL SPECIFICATIONS (T
A
= 25°C unless otherwise noted)
PARAMETER
CONDITIONS
SYMBOL
TYP
MAX
UNIT
Forward voltage
(1)
I
F
= 0.5A, T
J
= 25°C
V
F
0.90
-
V
I
F
= 1A, T
J
= 25°C
0.96
1.10
V
I
F
= 0.5A, T
J
= 125°C
0.78
-
V
I
F
= 1A, T
J
= 125°C
0.85
0.98
V
Reverse current @ rated V
R
(2)
T
J
= 25°C
I
R
-
1
µA
T
J
= 125°C
-
50
µA
Junction capacitance
1MHz, V
R
= 4.0V
C
J
8
-
pF
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms
ORDERING INFORMATION
ORDERING CODE
(1)
PACKAGE
PACKING
S1xAL
Thin SMA
14,000 / Tape & Reel
Notes:
1. "x" defines voltage from 200V(S1DAL) to 1000V(S1MAL)