Datasheet

RS2DAL – RS2MAL
Taiwan Semiconductor
2 Version: B2103
THERMAL PERFORMANCE
PARAMETER
SYMBOL
TYP
UNIT
Junction-to-lead thermal resistance
R
ӨJL
16
°C/W
Junction-to-ambient thermal resistance
R
ӨJA
73
°C/W
Junction-to-case thermal resistance
R
ӨJC
14
°C/W
Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board)
ELECTRICAL SPECIFICATIONS (T
A
= 25°C unless otherwise noted)
PARAMETER
CONDITIONS
SYMBOL
TYP
MAX
UNIT
Forward voltage
(1)
RS2DAL
RS2GAL
RS2JAL
I
F
= 1.0A, T
J
= 25°C
V
F
0.93
-
V
I
F
= 2.0A, T
J
= 25°C
1.01
1.30
V
I
F
= 1.0A, T
J
= 125°C
0.78
-
V
I
F
= 2.0A, T
J
= 125°C
0.88
1.02
V
RS2KAL
RS2MAL
I
F
= 1.0A, T
J
= 25°C
0.98
-
V
I
F
= 2.0A, T
J
= 25°C
1.06
1.30
V
I
F
= 1.0A, T
J
= 125°C
0.83
-
V
I
F
= 2.0A, T
J
= 125°C
0.93
1.05
V
Reverse current @ rated V
R
(2)
T
J
= 25°C
I
R
-
1
µA
T
J
= 125°C
-
40
µA
Reverse recovery time
RS2DAL
RS2GAL
I
F
= 0.5A, I
R
= 1.0A,
I
rr
= 0.25A
t
rr
-
150
ns
RS2JAL
-
250
ns
RS2KAL
RS2MAL
-
500
ns
Junction capacitance
RS2DAL
RS2GAL
RS2JAL
1MHz, V
R
= 4.0V
C
J
11
-
pF
RS2KAL
RS2MAL
10
-
pF
Notes:
1. Pulse test with PW = 0.3ms
2. Pulse test with PW = 30ms
ORDERING INFORMATION
ORDERING CODE
(1)
PACKAGE
PACKING
RS2xAL
Thin SMA
14,000 / Tape & Reel
Notes:
1. "x" defines voltage from 200V(RS2DAL) to 1000V(RS2MAL)