Datasheet

Small Signal Product
CREAT BY ART
- Fast switching device (trr<4.0ns)
- Surface device type mounting
- Matte Tin(Sn) terminal finish
- Pb free version and RoHS compliant
- Case: Mini-MELF Package
- High temperature soldering guaranteed: 270°C/10s
- Polarity: Indicated by black cathode band
- Weight: 31mg (approximately)
SYMBOL UNIT
P
D
mW
V
RRM
V
V
R
V
I
FSM
A
I
FM
mA
I
F(AV)
mA
I
F
mA
I
FRM
mA
R
θJA
o
C/W
T
J
, T
STG
o
C
SYMBOL UNIT
nA
μA
V
R
=0 f=1.0MHz C
J
pF
t
rr
ns
Document Number: DS_S1408022 Version: J15
LL4448, LL914B
Forward Voltage
Junction Capacitance
-
0.62
-
-
-
-
4-
I
R
=100μA
I
R
=5μA
V
R
=75V
V
R
=20V
I
F
=100 mA
I
F
=50 mA
I
F
=5 mA
-
0.72
25
5
-4
1
1
Note 3: Reverse recovery test conditions : I
F
=I
R
=10mA, R
L
=100Ω, I
RR
=1mA
V
(BR)
V
F
I
R
100
75
-
-
PARAMETER
MIN
Note 1: Test condition : 8.3 ms single half sine-wave superimposed on rated load (JEDEC method)
Note 2: Valid provided that electrodes are kept at ambient temperature
(Note 3)Reverse Recovery Time
Reverse Breakdown Voltage
Reverse Leakage Current
LL4448, LL914B
LL4148
Junction and Storage Temperature Range
Thermal Resistance (Junction to Ambient) (Note 2)
Repetitive Peak Forward Current
MINI MELF
Hermetically Sealed Glass
150
150
450
2
75
V
Forward Continuous Current
Mean Forward Current
Non-Repetitive Peak Forward Current
Peak Forward Surge Current (Note 1)
V
MAX
-65 to +175
300
450
Reverse Voltage
Repetitive Peak Reverse Voltage
PARAMETER VALUE
Power Dissipation 500
75
LL4148/LL4448/LL914B
Taiwan Semiconductor
Hi
g
h S
p
eed SMD Switchin
g
Diode
FEATURES
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
MECHANICAL DATA