User's Manual

V3d Product Specification, Version 2.06
Appendix A. Terminology
The table below defines terms, acronyms and abbreviations used throughout this document.
Term Definition
ASIC Application Specific Integrated Circuit
IMB Information Management Bureau
DSP Digital Signal Processor
DVT Design Verification Test
E
2
PROM Electrically Erasable Programmable Read Only Memory
ESD Electrostatic Discharge
GND Ground signal on RS-232
GSM Global System for Mobile Communications
I
2
S Inter-IC Sound
IEC International Electrotechnical Commission
LEO Low-Earth Orbit
MCU Micro-Controller Unit
MTBF Mean Time Between Failure
n/a Not available or not applicable
PA Power Amplifier
PCB Printed Circuit Board
PSI Pounds per Square Inch
RF Radio Frequency
SAE Society of Automotive Engineers
SC Subscriber Communicator, i.e. ORBCOMM data modem
SCLK System Clock
SPI Serial Peripheral Interface
TBD To Be Determined
TCXO Temperature Compensated Crystal Oscillator
VCO Voltage Controlled Oscillator
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