Data Sheet
RM9000
Multiprotocol 2.4GHz Wireless Module
Datasheet
10 / 17
System Design Co., Ltd.
4.7
Nonvolatile (Flash) Memory Characteristics
Over operating free-air temperature range and V
DDS
= 3.0 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
Flash sector size
8
KB
Supported flash erase cycles before failure, full bank
(1)
(5)
30
k Cycles
Supported flash erase cycles before failure, single
sector
(2)
60
k Cycles
Maximum number of write operations per row before
sector erase
(3)
83
Write
Operations
Flash retention
85 °C
11.4
Years at
85 °C
Flash sector erase current
Average delta current
10.7
mA
Flash sector erase time
(4)
Zero cycles
10.0
ms
Flash write current
Average delta current, 4 bytes at a time
6.2
mA
Flash write time
(4)
4 bytes at a time
21.6
µs
(1) A full bank erase is counted as a single erase cycle on each sector
(2) Up to 4 customer-designated sectors can be individually erased an additional 30k times beyond the baseline bank limitation of 30k
cycles
(3) Each wordline is 2048 bits (or 256 bytes) wide. This limitation corresponds to sequential memory writes of 4 (3.1) bytes minimum per
write over a whole wordline. If additional writes to the same wordline are required, a sector erase is required once the maximum
number of write operations per row is reached.
(4) This number is dependent on Flash aging and increases over time and erase cycles
(5) Aborting flash during erase or program modes is not a safe operation.
4.8
Thermal Resistance Characteristics
THERMAL METRIC
(1)
PACKAGE
UNIT
RGZ
(VQFN)
48 PINS
R
θJA
Junction-to-ambient thermal resistance
23.4
°C/W
(2)
R
θJC(top)
Junction-to-case (top) thermal resistance
13.3
°C/W
(2)
R
θJB
Junction-to-board thermal resistance
8.0
°C/W
(2)
ψ
JT
Junction-to-top characterization parameter
0.1
°C/W
(2)
ψ
JB
Junction-to-board characterization parameter
7.9
°C/W
(2)
R
θJC(bot)
Junction-to-case (bottom) thermal resistance
1.7
°C/W
(2)
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) °C/W = degrees Celsius per watt.
4.9
RF Frequency Bands
Over operating free-air temperature range (unless otherwise noted).
PARAMETER
MIN
TYP
MAX
UNIT
Frequency bands
2360
2500
MHz
4.10
Bluetooth Low Energy - Receive (RX)
Measured on the CC1352PEM-XD7793-XD24-PA24 reference design with T
c
= 25 °C, V
DDS
= 3.0 V, f
RF
= 2440 MHz with
DC/DC enabled and high power PA connected to V
DDS
unless otherwise noted.
All measurements are performed at the antenna input with a combined RX and TX path, except for high power PA which is
measured at a dedicated antenna connection. All measurements are performed conducted.
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
125 kbps (LE Coded)
Receiver sensitivity
Differential mode. BER = 10
–3
–105
dBm