Product Manual

Figure 2: Location of solder pads on the underside of the Tile

3.3 Reflow Soldering

The Tile is designed to be reflow soldered onto a PCB. A recommended reflow profile can be

found below in Figure 3 and Table 4

Use of "No Clean" soldering paste is strongly recommended, as it does not require cleaning

after the soldering process has taken place. The paste listed in the example below meets these

criteria:

Soldering Paste: M8 SAC305 / PN#89268 (AIM Solder)

Alloy specification: Sn 95.5/ Ag 4/ Cu 0.5 (96.5% Tin/ 3% Silver/ 0.5% Copper)

Melting Temperature: 217° C

Stencil Thickness: 100 to 150 µm for base boards