Turing Module Spec Date Version Description 2020-8-28 V1.0 Release V1.0 This document contains information that is proprietary to EICCOMM. This document is commercially confidential and must NOT be disclosed to third parties without prior consent. The information provided herein is believed to be reliable. But production testing may not include testing of all parameters. EICCOMM reserves the right to change information at any time without notification.
Contents 1. General description 4 1.1 Block diagram 4 2. Key Features 5 3. Electrical Specifications 5 3.1 Absolute Maximum Ratings 5 3.2 Recommended Operating Condition 6 3.3 DC characteristics 6 3.4 RF Specifications 6 4. Hardware Design 8 4.1 Pin Definition 8 4.2 Reference Design 8 4.3 Appearance and Dimensions 11 5. Layout Guideline 11 6. Package 12 6.1 Module Packaging 12 6.2 Module Label 12 6.2.1 QR Code 12 7.
List of Tables 1 Absolute Maximum Ratings 5 2 Recommended Operation Condition 6 3 DC Characteristics (VDD=3.
1. General Description Turing Module is a SOC module developed based on the Telink TLSR8258F512ET chip. The Turing Module integrates a power-balanced 32-bit MCU, BLE/802.15.4/ 2.
2. The BLE/802.15.4/2.4GHz Radio, USB and Audio (I2S, DMIC, AMIC) are powered down by default. 3. The power management module and clock should be always powered on, even in deep sleep. 4. In deep sleep, except for the power management and clock, all other modules should be powered down. 2. Key Features • Bluetooth 5 Compliant, 1Mbps, 2Mbps, Long Range 125kbps and 500kbps • IEEE802.15.4 compliant, 250kbps • 2.
3.2 Recommended Operating Condition Item Sym Min Typ Max Unit Power-supply Voltage VD D 1.8 3.3 3.6 V Condition All AVDD,DVDD and VDD_IO pin must have the same voltage tR Supply Rise Time（from 1.6V to 10 ms -40 85 ◦C ET Version -40 125 ◦C AT Version 1.8V） TOpr Operating Temperature Range Table 2: Recommended Operation Condition 3.3 DC characteristics Item Sym Unit Condition RX Current IRx 5.3 mA Whole Chip TX Current ITx 4.
Item Sym RX Sensitivity Min 1Mbps Frequency Offset Tolerance Typ Max -96 -250 Unit Condition dBm +300 kHz TX power，Maximum Setting 10 dBm TX power，Minimum Setting -45 dBm Programmable output power range 55 Db Modulation 20dB Bandwidth 2.
4. Hardware Design 4.1 Pin Definition Pin NO.
NOTES: 1) All digital IOs including PA<0> ~ PD<7> can be used as GPIOs and have configurable pull-up/pulldown resistor. 2) SPI: ◎ PD<7>: SPI_CK, PB<6>: SPI_DI, PB<7>: SPI_DO, PD<2>: SPI_CN ◎ PA<2>: DO, PA<3>: DI, PA<4>: CK, PD<6>: CN 3) I2C: ◎ PC<0> ~ PC<3> can be used as I2C. PC<0>: I2C_SDA, PC<1>: I2C_SCK, PC<2>: I2C_SDA, PC<3>: I2C_SCK ◎ I2C can also be multiplexed with SPI interface, i.e. I2C_SDA/I2C_SCK can be multiplexed with SPI_DI /SPI_CK respectively. 4) Audio PGA/AMIC input: PC<0>~PC<3>.
13) 14) 15) 16) 17) ◎ATSEL0~2 serves to select one of up to eight external antennas connected to the antenna select component. The selected antenna channel is connected to the RF_IO pin. Low power comparator input: PB<1>~ PB<7>. ADC GPIO input: PB<0>~ PB<7>, PC<4>~ PC<5> For 24MHz crystal, the load capacitor range supported by design is 7.33pF~12.66pF. If the crystal needs load capacitor of 15pF, two external capacitors will be required. Do not use PC<7:5> for dynamic applications.
4.3 Appearance and Dimensions The following picuture shows the appearance and dimensions of the module. The components and prominent structure are not allowed put in this size range. Figure 3: Module Appearance 2.2mm Figure 4: Module Dimensions 5. Layout Guideline The layout on user PCB should be designed according to the following guide- line.
Figure 5: Layout Guideline 6. Package 6.1 Module Packaging Tray package. 6.2 Module Label BLE module label on shield case combines QR code and plain text. 6.2.1 QR Code There is a ⌜QR Code⌜ label in each product, which show device type and address infomation. QR code format: < mac address > # < module label > Label demo shows in following picture: 5A9A04E717A5 0.4 x 7.
7. Welding Declare The Turing module only supports one reflow soldering, and the module failure caused by multiple reflow soldering is not responsible.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Changes or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
Integration instructions for host product manufacturers according to KDB 996369 D03 OEM Manual v01 2.2 List of applicable FCC rules CFR 47 FCC PART 15 SUBPART C has been investigated. It is applicable to the modular. 2.3 Specific operational use conditions This module is stand-alone modular.
