Datasheet

72 Datasheet
The upper point of the thermal profile consists of the Thermal Design Power (TDP) defined in
Table 23 and the associated T
CASE
value. It should be noted that the upper point associated with the
Thermal Profile (x = TDP and y = T
CASE_MAX
@ TDP) represents a thermal solution design point.
In actuality the processor case temperature will never reach this value due to TCC activation (see
Figure 12).
Please note that, although Table 24 does not indicate a T
CONTROL
value, production units will be
programmed with a value. Please see Section 6.2.6 for more information on T
CONTROL
.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained time periods. Intel recommends that complete thermal solution designs
target the Thermal Design Power (TDP) indicated in Table 23, instead of the maximum processor
power consumption. The Thermal Monitor feature is intended to help protect the processor in the
event that an application exceeds the TDP recommendation for a sustained time period. For more
details on this feature, refer to Section 6.2. Thermal Monitor feature must be enabled for the
processor to remain within specification.
Table 23. Low Voltage Intel
®
Xeon™ Processor with 800 MHz System Bus Thermal
Specifications
Core
Frequency
(GHz)
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
2.80 GHz 62.1 55 5
See Figure 12;
Table 24
1, 2, 3, 4, 5
NOTES:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at specified I
CC
. Please refer to the V
CC
static and transient tolerance specifications in Section 2.0.
2. Maximum Power is the maximum thermal power that can be dissipated by the processor through the
integrated heat spreader (IHS). Maximum Power is measured at maximum T
CASE
.
3. Thermal Design Power (TDP) should be used for processor/chipset thermal solution design targets. TDP is
not the maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
4. These specifications are based on initial silicon characterization. These specifications may be further
updated as more characterization data becomes available.
5. Power specifications are defined at all VIDs found in Table 9. The Low Voltage Intel
®
Xeon™ processor
with 800 MHz system bus may be shipped under multiple VIDs listed for each frequency.