Datasheet

Datasheet 3
Contents
1.0 Introduction....................................................................................................................................9
1.1 Terminology........................................................................................................................10
1.2 References .........................................................................................................................12
1.3 State of Data.......................................................................................................................12
2.0 Electrical Specifications .............................................................................................................13
2.1 Power and Ground Pins......................................................................................................13
2.2 Decoupling Guidelines........................................................................................................13
2.2.1 V
CC
Decoupling .....................................................................................................13
2.2.2 VTT
Decoupling .....................................................................................................13
2.2.3 Front Side Bus AGTL+ Decoupling........................................................................14
2.3 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ...............................................14
2.3.1 Front Side Bus Frequency Select Signals (BSEL[1:0])..........................................14
2.3.2 Phase Lock Loop (PLL) and Filter .........................................................................15
2.4 Voltage Identification (VID) .................................................................................................16
2.5 Reserved or Unused Pins...................................................................................................18
2.6 Front Side Bus Signal Groups ............................................................................................19
2.7 GTL+ Asynchronous and AGTL+ Asynchronous Signals...................................................22
2.8 Test Access Port (TAP) Connection ...................................................................................22
2.9 Mixing Processors ..............................................................................................................22
2.10 Absolute Maximum and Minimum Ratings .........................................................................23
2.11 Processor DC Specifications ..............................................................................................24
2.11.1 VCC Overshoot Specification ................................................................................30
2.11.2 Die Voltage Validation ...........................................................................................31
3.0 Mechanical Specifications..........................................................................................................35
3.1 Package Mechanical Drawings...........................................................................................35
3.2 Processor Component Keepout Zones...............................................................................38
3.3 Package Loading Specifications.........................................................................................38
3.4 Package Handling Guidelines.............................................................................................39
3.5 Package Insertion Specifications........................................................................................39
3.6 Processor Mass Specifications...........................................................................................39
3.7 Processor Materials............................................................................................................39
3.8 Processor Markings............................................................................................................40
3.9 Processor Pinout Coordinates ............................................................................................41
4.0 Signal Definitions .......................................................................................................................43
4.1 Signal Definitions ................................................................................................................43
5.0 Pin List..........................................................................................................................................53
5.1 Low Voltage Intel
®
Xeon™ Processor with 800 MHz System Bus Pin Assignments .........53
5.1.1 Pin Listing by Pin Name.........................................................................................54
5.1.2 Pin Listing by Pin Number .....................................................................................62
6.0 Thermal Specifications ..............................................................................................................71
6.1 Package Thermal Specifications ........................................................................................71
6.1.1 Thermal Specifications ..........................................................................................71