Data Sheet

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September 2013 Rev 8 1/33

VNH3SP30-E

Automotive fully integrated H-bridge motor driver

Features

■ Output current: 30A

■ 5V logic level compatible inputs

■ Undervoltage and overvoltage shutdown

■ Overvoltage clamp

■ Thermal shut down

■ Cross-conduction protection

■ Linear current limiter

■ Very low standby power consumption

■ PWM operation up to 10 kHz

■ Protection against loss of ground and loss of

■ Package: ECOPACK

Description

The VNH3SP30-E is a full-bridge motor driver

intended for a wide range of automotive

applications. The device incorporates a dual

monolithic high-side driver (HSD) and two low-

side switches. The HSD switch is designed using

STMicroelectronics proprietary VIPower™ M0-3

technology that efficiently integrates a true Power

MOSFET with an intelligent signal/protection

circuit on the same die.

The low-side switches are vertical MOSFETs

manufactured using STMicroelectronics

proprietary EHD (“STripFET™”) process.The

three circuits are assembled in a MultiPowerSO-

30 package on electrically isolated lead frames.

This package, specifically designed for the harsh

automotive environment, offers improved thermal

performance thanks to exposed die pads.

Moreover, its fully symmetrical mechanical design

provides superior manufacturability at board level.

The input signals IN

and IN

can directly

interface with the microcontroller to select the

motor direction and the brake condition. Pins

DIAG

/EN

or DIAG

/EN

, when connected to an

external pull-up resistor, enable one leg of the

bridge. They also provide a feedback digital

diagnostic signal. The normal condition operation

is explained in The speed of the motor can be

controlled in all possible conditions by the PWM

up to kHz. In all cases, a low level state on the

PWM pin will turn off both the LS

and LS

switches. When PWM rises to a high level, LS

turn on again depending on the input pin

state.

Type R

DS(on)

out

ccmax

VNH3SP30-E

45mmax

per leg)

30A 40V

MultiPowerSO-30™

Table 1. Device summary

Package

Order codes

Tube Tape & reel

MultiPowerSO-30 VNH3SP30-E VNH3SP30TR-E

www.st.com

Summary of content (33 pages)

PAGE 1
VNH3SP30-E Automotive fully integrated H-bridge motor driver Features Type RDS(on) Iout Vccmax VNH3SP30-E 45mmax per leg) 30A 40V MultiPowerSO-30™ ■ Output current: 30A ■ 5V logic level compatible inputs ■ Undervoltage and overvoltage shutdown ■ Overvoltage clamp ■ Thermal shut down ■ Cross-conduction protection ■ Linear current limiter ■ Very low standby power consumption ■ PWM operation up to 10 kHz ■ Protection against loss of ground and loss of VCC ■ Package: ECOPACK® Th
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Contents VNH3SP30-E Contents 1 Block diagram and pins description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 4 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.3 Electrical characteristics curves . . . . . .
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VNH3SP30-E List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Block description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin definitions and functions . . . . .
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List of figures VNH3SP30-E List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. Figure 28. Figure 29. Figure 30. Figure 31. Figure 32. Figure 33. Figure 34. Figure 35. Figure 36. Figure 37. Figure 38. Figure 39. Figure 40. Figure 41. Figure 42. Figure 43.
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VNH3SP30-E 1 Block diagram and pins description Block diagram and pins description Figure 1. Block diagram Table 2. Block description Name Description Logic control Allows the turn-on and the turn-off of the high side and the low side switches according to the truth table Overvoltage + undervoltage Shuts down the device outside the range [5.5V..
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Block diagram and pins description VNH3SP30-E Figure 2. Configuration diagram (top view) Table 3.
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VNH3SP30-E Block diagram and pins description Table 4. Pin functions description Name VCC Description Battery connection GNDA, GNDB Power grounds; must always be externally connected together OUTA, OUTB Power connections to the motor INA, INB Voltage controlled input pins with hysteresis, CMOS compatible. These two pins control the state of the bridge in normal operation according to the truth table (brake to VCC, brake to GND, clockwise and counterclockwise).
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Electrical specifications 2 Electrical specifications Figure 3. 2.1 8/33 VNH3SP30-E Current and voltage conventions Absolute maximum ratings Table 5. Absolute maximum ratings Symbol Parameter Value Unit -0.3...
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VNH3SP30-E 2.2 Electrical specifications Electrical characteristics Vcc = 9V up to 18V; -40°C < Tj < 150°C, unless otherwise specified. Table 6. Symbol VCC IS Power section Parameter Test Conditions Operating supply voltage Supply current Min Typ Max Unit 5.
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Electrical specifications Table 8. Symbol PWM Parameter Vpwl PWM low level voltage Ipwl PWM low level pin current Vpwh PWM high level voltage Ipwh PWM high level pin current Vpwhhyst PWM hysteresis voltage Vpwcl PWM clamp voltage Vpwtest Test mode PWM pin voltage Ipwtest Test mode PWM pin current Table 9. Symbol Test Conditions Min Vpw = 1.5V Typ Max Unit 1.5 V 1 µA 3.25 V Vpw = 3.25V 10 µA V 0.5 Ipw = 1mA VCC + 0.3 VCC + 0.7 VCC + 1 Ipw = -1mA -5 -3.5 -2 -3.
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VNH3SP30-E Figure 4. Electrical specifications Definition of the delay times measurement VINA t VINB t PWM t ILOAD tDEL tDEL t Figure 5.
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Electrical specifications Figure 6.
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VNH3SP30-E Electrical specifications Table 11. INA Truth table in normal operating conditions INB DIAGA/ENA DIAGB/ENB OUTA 1 1 OUTB H Brake to VCC L Clockwise (CW) H Counterclockwise (CCW) L Brake to GND H 0 1 Operating mode 1 1 0 L 0 Table 12.
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Electrical specifications Table 13. VNH3SP30-E Electrical transient requirements ISO T/R - 7637/1 Test Level Test Level Test Level Test Level Test Levels Test Pulse I II III IV Delays and Impedance 1 -25V -50V -75V -100V 2ms, 10 2 +25V +50V +75V +100V 0.2ms, 10 3a -25V -50V -100V -150V 3b +25V +50V +75V +100V 4 -4V -5V -6V -7V 100ms, 0.01 5 +26.5V +46.5V +66.5V +86.5V 400ms, 2 0.
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VNH3SP30-E Electrical specifications 2.3 Electrical characteristics curves Figure 7. On state supply current Figure 8. Figure 9. High level input current Figure 10. Input clamp voltage Figure 11. Input high level voltage Off state supply current Figure 12.
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Electrical specifications VNH3SP30-E Figure 13. Input hysteresis voltage Figure 14. High level enable pin current Figure 15. Delay time during change of operation mode Figure 16. Enable clamp voltage Figure 17. High level enable voltage Figure 18.
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VNH3SP30-E Electrical specifications Figure 19. PWM high level voltage Figure 20. PWM low level voltage Figure 21. PWM high level current Figure 22. Overvoltage shutdown Figure 23. Undervoltage shutdown Figure 24.
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Electrical specifications VNH3SP30-E Figure 25. On state high side resistance vs Tcase Figure 26. On state low side resistance vs Tcase Figure 27. On state high side resistance vs Vcc Figure 28. On state low side resistance vs Vcc Figure 29. Output voltage rise time Figure 30.
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VNH3SP30-E Figure 31. Enable output low level voltage Electrical specifications Figure 32.
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Application information 3 VNH3SP30-E Application information In normal operating conditions the DIAGX/ENX pin is considered as an input pin by the device. This pin must be externally pulled high. PWM pin usage: In all cases, a “0” on the PWM pin will turn off both LSA and LSB switches. When PWM rises back to “1”, LSA or LSB turn on again depending on the input pin state. Figure 33.
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VNH3SP30-E Application information Possible origins of fault conditions may be: ● ● OUTA is shorted to ground  overtemperature detection on high side A. OUTA is shorted to VCC  low side power MOSFET saturation detection(a). When a fault condition is detected, the user can know which power element is in fault by monitoring the INA, INB, DIAGA/ENA and DIAGB/ENB pins. In any case, when a fault is detected, the faulty leg of the bridge is latched off.
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Application information 3.3 VNH3SP30-E Test mode The PWM pin can be used to test the load connection between two half-bridges. In the Test mode (Vpwm = -2V) the internal power MOS gate drivers are disabled. The INA or INB inputs can be used to turn on the high side A or B, respectively, in order to connect one side of the load at VCC voltage. The check of the voltage on the other side of the load can be used to verify the continuity of the load connection.
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VNH3SP30-E Application information Figure 36.
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Application information Figure 37.
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VNH3SP30-E Package and PCB thermal data 4 Package and PCB thermal data 4.1 MultiPowerSO-30 thermal data Figure 38. MultiPowerSO-30™ PC board Layout condition of Rth and Zth measurements (PCB FR4 area = 58mm x 58mm, PCB thickness = 2mm, Cu thickness = 35m, Copper areas: from minimum pad layout to 16cm2). Figure 39. Chipset configuration HIGH SIDE CHIP HSAB LOW SIDE CHIP A LOW SIDE CHIP B LSA LSB Figure 40.
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Package and PCB thermal data 4.1.1 Thermal calculation in clockwise and anti-clockwise operation in steady-state mode Table 14. Thermal calculation in clockwise and anti-clockwise operation in steadystate mode HSA HSB LSA LSB 4.1.
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VNH3SP30-E Package and PCB thermal data Equation 1: pulse calculation formula Z TH = R TH   + Z THtp  1 –   where  = t p  T Figure 41. MultiPowerSO-30 HSD thermal impedance junction ambient single pulse 100 Footprint 4 cm2 8 cm2 16 cm2 ZthHS Footprint 4 cm2 8 cm2 16 cm2 10 °C/W ZthHSLS 1 0.1 0.001 0.01 0.1 time (sec) 1 10 100 1000 Figure 42.
PAGE 28
Package and PCB thermal data VNH3SP30-E Figure 43. Thermal fitting model of an H-bridge in MultiPowerSO-30 Table 15. Thermal parameters(1) Area/island (cm2) Footprint R1 = R7 (°C/W) 0.05 R2 = R8 (°C/W) 0.3 R3 (°C/W) 0.5 R4 (°C/W) 1.3 R5 (°C/W) 14 R6 (°C/W) 44.7 R9 = R10= R15= R16 (°C/W) 0.6 R11 = R17 (°C/W) 0.8 R12 = R18 (°C/W) 1.5 R13 = R19 (°C/W) 20 R14 = R20 (°C/W) 46.9 R21 = R22 = R23 (°C/W) 115 C1 = C7 = C9 = C15 (W.s/°C) 0.001 C2 = C8 (W.s/°C) 0.005 C3 = (W.s/°C) 0.
PAGE 29
VNH3SP30-E Package and packing information 5 Package and packing information 5.1 ECOPACK® packages In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second-level interconnect. The category of Second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
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Package and packing information Table 16. VNH3SP30-E MultiPowerSO-30 mechanical data Millimeters Symbol Min Typ A 2.35 A2 1.85 2.25 A3 0 0.1 B 0.42 0.58 C 0.23 0.32 D 17.1 E 18.85 E1 15.9 e 17.2 17.3 19.15 16 16.1 1 F1 5.55 6.05 F2 4.6 5.1 F3 9.6 10.1 L 0.8 1.15 N S 10deg 0deg Figure 45.
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VNH3SP30-E Package and packing information 5.3 Packing information Note: The devices can be packed in tube or tape and reel shipments (see the Device summary on page 1 for packaging quantities). Figure 46. MultiPowerSO-30 tube shipment (no suffix) Dimension A C mm Tube length (± 0.5) A B C (± 0.13) B 532 3.82 23.6 0.8 Figure 47. MultiPowerSO-30 tape and reel shipment (suffix “TR”) Reel dimensions Dimension mm A (max) B (min) C (± 0.2) D (min) G (+ 2 / -0) N (min) T (max) 330 1.5 13 20.
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Revision history 6 VNH3SP30-E Revision history Table 17. Document revision history Date Revision Description of changes Aug-2004 1 Initial release of lead-free version based on the VNH3SP30 datasheet (May 2004 - Rev.1) Aug- 2005 2 Modified figure 5 3 Document converted into new ST corporate template. Changed document title . Changed features on page 1 to add ECOPACK® package. Added section 1: device block description on page 5. Added section 2: pinout description on page 6.
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VNH3SP30-E Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.