User Manual

240-Pin Unbuffered DIMM DDR3 SDRAM
http://www.supertalent.com/oem Products and Specifications discussed herein are subject to change without notice
2 © 2006 Super Talent Tech., Corporation.
1.0 Features
JEDEC standard VDD = VDDQ = 1.5V +/- 0.075V Power Supply
1.5V centered-terminated push-pull I/O
Programmable CAS latencies (5,6,7,8,9,10), Burst Length (4 & 8) and Burst Type
Auto Refresh (CRB) and Self Refresh
Bi-directional Differential Data Strobe
Off Chip Driver (OCD) impedance adjustment
On-Die termination using ODT pin
8 independent internal bank
Average Refresh Period 7.8us at lower than a TCASE 85°C, 3.9us at 85°C < TCASE < 95 °C - support High Temperature
Self-Refresh rate enable feature
Serial presence detect with EEPROM
DIMM Dimension (Nominal) 30.00 mm high, 133.35 mm wide
Based on JEDEC standard reference Raw Cards Lay out.
RoHS compliant
Gold plated contacts
2.0 Ordering Information
These products can be ordered as individual 2GB DIMMs or as 4GB kits (2x 2GB).
Part number* Density
Module
Organization
Component
composition
Component
PKG
Module
Rank
Description
W1066UB2Gx 2GB 256Mx64 128Mx8*16 TFBGA 2
2GB 2Rx8
PC3-8500U
W1066UX4Gx
4GB Kit
(2x 2GB)
2x 256Mx64 128Mx8*16 TFBGA 2
2GB 2Rx8
PC3-8500U
W1333UB2Gx 2GB 256Mx64 128Mx8*16 TFBGA 2
2GB 2Rx8
PC3-10600U
W1333UX4Gx
4GB Kit
(2x 2GB)
2x 256Mx64 128Mx8*16 TFBGA 2
2GB 2Rx8
PC3-10600U
*Last digit of part number indicates DRAM chip brand: E = Elpida; M = Micron; Q = Qimonda; S = Samsung.
3.0 Key Timing Parameters
DDR3-1333 DD3-1066 Unit
CL-tRCD-tRP
9-9-9
7-7-7 tCK
CAS Latency
9
7 tCK
tCK(min)
1.5
1.875 ns
tRCD(min)
13.5
13.125 ns
tRP(min)
13.5
13.125 ns
tRAS(min)
36
37.5 ns
tRC(min)
49.5
50.625 ns
4.0 Absolute Maximum DC Rating
Symbol Parameter Rating Units
V
in ,
Vout Voltage on any pin relative to V
SS
-0.4 ~ 1.975 V
V
DD
Voltage on V
DD
& V
DDQ
supply relative to V
ss
-0.4 ~ 1.975 V
V
DDQ
Short circuit current -0.4 ~ 1.975 V
V
DDL
Power dissipation -0.4 ~ 1.975 V