Data Sheet

TCS3200, TCS3210
PROGRAMMABLE
COLOR LIGHT-TO-FREQUENCY CONVERTER
TAOS099 − JULY 2009
10
r
r
Copyright E 2009, TAOS Inc.
The LUMENOLOGY r Company
www.taosinc.com
MECHANICAL INFORMATION
This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically
nonconductive clear plastic compound. The TCS3210 has a 4 × 6 array of photodiodes with a total size of 0.54 mm
by 0.8 mm. The photodiodes are 110 μm × 110 μm in size and are positioned on 134 μm centers.
PACKAGE D PLASTIC SMALL-OUTLINE
A
1.75
1.35
0.50
0.25
4.00
3.80
6.20
5.80
45
0.88 TYP TOP OF
SENSOR DIE
5.00
4.80
5.3
MAX
1.27
0.41
0.25
0.10
0.25
0.19
DETAIL A
PIN 1
6  1.27
0.510
0.330
8 
 2.8 TYP
CLEAR WINDOW
2.12
 0.250
3.00  0.250
NOTE B
Pb
PIN 1
TOP VIEW BOTTOM VIEW
SIDE VIEW
END VIEW
NOTES: A. All linear dimensions are in millimeters.
B. The center of the 0.54-mm by 0.8-mm photo-active area is referenced to the upper left corner tip of the lead frame (Pin 1).
C. Package is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. This drawing is subject to change without notice.
Figure 8. Package D — TCS3210 Plastic Small Outline IC Packaging Configuration