Datasheet
Table Of Contents
- Z01
- Standard
- 1 A Triacs
- 1 Characteristcs
- Table 2. Electrical characteristics (Tj = 25 C, unless otherwise specified)
- Table 3. Static characteristics
- Table 4. Thermal resistances
- Figure 1. Maximum power dissipation versus RMS on-state current (full cycle)
- Figure 2. RMS on-state current versus ambient temperature (full cycle)
- Figure 3. RMS on-state current versus ambient temperature (full cycle)
- Figure 4. Relative variation of thermal impedance versus pulse duration
- Figure 5. Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values)
- Figure 6. Surge peak on-state current versus number of cycles
- Figure 7. Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t
- Figure 8. On-state characteristics (maximum values)
- Figure 9. Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values)
- Figure 10. Relative variation of critical rate of decrease of main current versus junction temperature
- Figure 11. SOT-223 Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm)
- 2 Ordering information scheme
- 3 Packaging information
- 4 Ordering information
- 5 Revision History
Packaging information Z01
6/8
3 Packaging information
Figure 12. SOT-223 Footprint dimensions (in millimeters)
Table 6. SOT-223 Dimensions
REF.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A1.800.071
A1 0.02 0.001
B 0.60 0.70 0.80 0.024 0.027 0.031
B1 2.90 3.00 3.10 0.114 0.118 0.122
c 0.24 0.26 0.32 0.009 0.010 0.013
D 6.30 6.50 6.70 0.248 0.256 0.264
e2.3 0.090
e1 4.6 0.181
E 3.30 3.50 3.70 0.130 0.138 0.146
H 6.70 7.00 7.30 0.264 0.276 0.287
V10° max
A
A1
e1
D
B1
H
E
e
12
4
3
B
V
c
3.25
1.32
7.80
5.16
1.32
2.30 0.95