Datasheet

VNQ5E160AK-E Package and PC board thermal data
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4 Package and PC board thermal data
4.1 PowerSSO-24 thermal data
Figure 35. PowerSSO-24 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area= 77 mm x 86 mm, PCB thickness=1.6 mm, Cu thickness=70 mm (front and back side),
Copper areas: from minimum pad lay-out to 8 cm
2
).
Figure 36.
R
thj-amb
vs. PCB copper area in open box free air condition (one channel ON)
30
35
40
45
50
55
60
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)