Datasheet

VNQ5160K-E Package and PC board thermal data
Doc ID 13349 Rev 7 23/30
4 Package and PC board thermal data
4.1 PowerSSO-24 thermal data
Figure 31. PowerSSO-24 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: double layer, thermal vias, FR4
area= 77mm x 86mm, PCB thickness=1.6mm, Cu thickness=70mm (front and back side),
copper areas: from minimum pad lay-out to 8cm
2
).
Figure 32.
R
thj-amb
vs PCB copper area in open box free air condition (one channel ON)
30
35
40
45
50
55
60
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)