Datasheet

Package and PC board thermal data VNQ5050AK-E
24/31 Doc ID 13329 Rev 10
4 Package and PC board thermal data
4.1 PowerSSO-24 thermal data
Figure 28. PowerSSO-24 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area= 77 mm x 86 mm, PCB thickness=1.6mm, Cu thickness=70 µm (front and back side),
Copper areas: from minimum pad lay-out to 8 cm
2
).
Figure 29.
R
thj-amb
vs PCB copper area in open box free air condition (one channel on)
30
35
40
45
50
55
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)