Datasheet

Package and PCB thermal data VNN7NV04P-E, VNS7NV04P-E
18/29 Doc ID 15632 Rev 4
4 Package and PCB thermal data
4.1 SO-8 thermal data
Figure 34. SO-8 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB
thickness = 2 mm, Cu thickness = 35 µm, Copper areas: 0.14 cm
2
, 0.8 cm
2
, 2 cm
2
).
Figure 35. R
thj-amb
vs PCB copper area in open box free air condition
70
75
80
85
90
95
100
105
110
00.511.522.5
PCB Cu heatsink area (cm^2)
RTHj_amb (ºC/W)
SO-8 at 2 pins connected to TAB