Datasheet

VNN1NV04P-E, VNS1NV04P-E Package and PCB thermal data
Doc ID 15586 Rev 3 19/28
4.2 SO-8 thermal data
Figure 34. SO-8 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm,PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: from minimum pad layout to 2 cm
2
).
Figure 35. SO-8 R
thj-amb
vs PCB copper area in open box free air condition
C1 (W·s/°C) 0.00006
C2 (W·s/°C) 0.0005
C3 (W·s/°C) 0.03
C4 (W·s/°C) 0.16
C5 (W·s/°C) 1000
C6 (W·s/°C) 0.5 2
Table 5. SOT-223 thermal parameter (continued)
Area/island (cm
2
)FP2
65
75
85
95
105
00,511,522,5
PCB Cu heatsink area (cm^ 2) - (refer to PCB layout)
footprint