Datasheet

VNN1NV04P-E, VNS1NV04P-E Package and PCB thermal data
Doc ID 15586 Rev 3 17/28
4 Package and PCB thermal data
4.1 SOT-223 thermal data
Figure 30. SOT-223 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm,PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: from minimum pad layout to
0.8 cm
2
).
Figure 31. SOT-223 R
thj-amb
vs PCB copper area in open box free air condition
.
60
70
80
90
100
110
120
130
140
0 0,5 1 1,5 2 2,5
PCB Cu heatsink area (cm^ 2) - (refer to PCB layout)
footprint