Datasheet

DocID16364 Rev 3 19/27
VNL5160N3-E, VNL5160S5--E Package and PC board thermal data
26
5.2 SO-8 thermal data
Figure 14. SO-8 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm,PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: from minimum pad layout to 2 cm
2
).
Table 16. SOT-223 thermal parameter
Area/island (cm
2
)FP2
R1 (°C/W) 1.4
R2 (°C/W) 1.8
R3 (°C/W) 4.5
R4 (°C/W) 24
R5 (°C/W) 0.1
R6 (°C/W) 115 45
C1 (W·s/°C) 0.0003
C2 (W·s/°C) 0.002
C3 (W·s/°C) 0.03
C4 (W·s/°C) 0.16
C5 (W·s/°C) 1000
C6 (W·s/°C) 0.4 2
GAPGCFT00534