Datasheet

DocID16364 Rev 3 17/27
VNL5160N3-E, VNL5160S5--E Package and PC board thermal data
26
5 Package and PC board thermal data
5.1 SOT-223 thermal data
Figure 10. SOT-223 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 30 mm x 30 mm,PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: from minimum pad layout to
0.8 cm
2
).
Figure 11. SOT-223 R
thj-amb
vs PCB copper area in open box free air condition
GAPGCFT00530
RTHj_amb(°C/W)
RTHjamb
60
70
80
90
100
110
120
130
140
150
160
0 0.5 1 1.5 2 2.5
PCB Cu heatsink area (cm^2) - (refer to PCB layout)
footprint