Datasheet

Package and PC board thermal data VNL5050N3-E, VNL5050S5-E
22/33 DocID15917 Rev 6
4.2 SO-8 thermal data
Figure 23. SO-8 PC board
1. Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm,
Cu thickness = 35 µm (front and back side), Copper areas: from minimum pad lay-out to 2 cm
2
).
Figure 24. R
thj-amb
vs. PCB copper area in open box free air condition
RTHj_amb(°C/W)
RTHjamb (°C/W)
65
75
85
95
105
00.511.522.5
PCB Cu heatsink area (cm
2
)
footprint
RTHj_amb(°C/W)
RTHjamb (°C/W)
65
75
85
95
105
00.511.522.5
PCB Cu heatsink area (cm
2
)
footprint