Datasheet

DocID15917 Rev 6 19/33
VNL5050N3-E, VNL5050S5-E Package and PC board thermal data
32
4 Package and PC board thermal data
4.1 SOT-223 thermal data
Figure 19. SOT-223 PC board
1. Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 30 mm x 58 mm, PCB thickness = 2 mm,
Cu thickness = 35 µm, copper areas: from minimum pad lay-out to 0.8 cm
2
).
Figure 20. R
thj-amb
vs. PCB copper area in open box free air condition
RTHj_amb(°C/W)
RTHjamb (°C/W)
60
70
80
90
100
110
120
130
140
150
00.511.522.5
PCB Cu heatsink area (cm
2
)
footprint
RTHj_amb(°C/W)
RTHjamb (°C/W)
60
70
80
90
100
110
120
130
140
150
00.511.522.5
PCB Cu heatsink area (cm
2
)
footprint