Datasheet

DocID15234 Rev 6 31/40
VNI8200XP Thermal management
14 Thermal management
The power dissipation in the IC is the main factor that sets the safe operating condition of
the device in the application. Therefore, it must be taken into account very carefully.
Heatsinking can be achieved using copper on the PCB with proper area and thickness. The
following image (Figure 13) shows the junction-to-ambient thermal impedance values for the
PSSO36 package.
Figure 13. PSSO36 thermal impedance vs. time
For instance, three cases have been considered using a PSSO36 packaged with copper
slug soldered on a 1.6 mm thickness FR4 board with dissipating footprint (copper thickness
of 70 μm):
• single layer PCB with just IC footprint dissipating area
• double layer PCB with footprint dissipating area on the top side and a 2 cm
2
dissipating
layer on the bottom side through 15 via holes
• double layer PCB with footprint dissipating area on the top side and an 8 cm
2
dissipating layer on the bottom side through 15 via holes.