Datasheet

DocID15234 Rev 6 11/40
VNI8200XP Electrical characteristics
4.1 Thermal data
5 Electrical characteristics
5.1 Power section
10.5 V < V
CC
< 36 V; -40 °C < T
J
< 125 °C; unless otherwise specified.
Table 4. Thermal data
Symbol Parameter Value Unit
R
th(JC)
Thermal resistance junction-case
(1)
1. Per channel.
Max. 2 °C/W
R
th(JA)
Thermal resistance junction-ambient
(2)
2. PSSO36 mounted on the board STEVALIFP022V1 developed on four layer FR4, with about 8 cm
2
for each
layer.
Max. 15 °C/W
Table 5. Power section
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
cc
Supply voltage 10.5 36 V
V
cc
Clamp Clamp on V
cc
Current 20 mA 45 50 52 V
R
DS(on)
On state resistance
I
OUT
= 0.5 A at T
J
= 25 °C
I
OUT
= 0.5 A
0.11
0.2
Ω
I
S
V
cc
supply current
All channels in OFF state, DC-
DC in OFF state, V
REG
=5 V,
SPI OFF
(1)
1. SS signal high, NO communication.
1mA
All channels in ON state, DC-
DC in ON state V
REG
=5 V, SPI
ON
(2)
2. SS signal low, communication ON.
5.6 mA
I
DS
V
REG
supply current
DC-DC OFF V
REG
= 5 V SPI
OFF WD_EN=0
200 µA
DC/DC OFF V
REG
=5 V SPI ON
WD_EN=V
REG
250 µA
I
LGND
Output current at
GND disconnection
All pins at 0 V except V
OUT
=
24 V
0.5 mA
V
OUT(OFF)
OFF state output
voltage
V
IN
= 0 V, IOUT = 0 A 1 V
I
OUT(OFF)
OFF state output
current
V
IN
= V
OUT
= 0 V 0 2 µA
F
CP
Charge pump
frequency
Channel in ON state
(3)
3. To cover EN55022 class A and class B normatives.
1.45 MHz