Datasheet
Table Of Contents
- Table 1. Device summary
- 1 Block diagram and pin description
- 2 Electrical specifications
- 2.1 Absolute maximum rating
- 2.2 Electrical characteristics
- Table 4. Power off
- Table 5. Power on
- Table 6. Dynamic
- Table 7. Gate resistance
- Table 8. Source drain diode
- Table 9. Switching on HSD
- Table 10. Switching on LSD
- Table 11. Switching off HSD
- Table 12. Switching off LSD
- Table 13. Thermal sensor
- Figure 4. Gate charge vs gate-source voltage HS
- Figure 5. Gate charge vs gate-source voltage LS
- Figure 6. Capacitance variations HS
- Figure 7. Capacitance variations LS
- Figure 8. Thermal sensor voltage vs temperature
- Figure 9. Gate charge test circuit
- Figure 10. Test circuit for inductive load switching and diode recovery times
- Figure 11. Switching times test circuit for resistive load
- 3 Package and PCB thermal data
- 3.1 PowerSSO-36 thermal data
- Figure 12. PowerSSO-36 PC board
- Figure 13. Chipset configuration
- Figure 14. Auto and mutual Rthj-amb vs PCB copper area in open box free air condition
- 3.1.1 Thermal calculation in clockwise and anti-clockwise operation in steady-state mode
- 3.1.2 Thermal resistances definition (values according to the PCB heatsink area)
- 3.1.3 Thermal calculation in transient mode
- 3.1.4 Single pulse thermal impedance definition (values according to the PCB heatsink area)
- 3.1 PowerSSO-36 thermal data
- 4 Package and packing information
- 5 Revision history

VNH7013XP-E Package and PCB thermal data
Doc ID 022370 Rev 3 17/24
3.1.2 Thermal resistances definition (values according to the PCB heatsink
area)
R
thHS
= R
thHSA
= R
thHSB
= High Side Chip Thermal Resistance Junction to Ambient (HS
A
or
HS
B
in ON state)
R
thLS
= R
thLSA
= R
thLSB
= Low Side Chip Thermal Resistance Junction to Ambient
R
thHSLS
= R
thHSALSB
= R
thHSBLSA
= Mutual Thermal Resistance Junction to Ambient
between High Side and Low Side Chips
R
thLSLS
= R
thLSALSB
= Mutual Thermal Resistance Junction to Ambient between Low Side
Chips
3.1.3 Thermal calculation in transient mode
(a)
T
jHSAB
= Z
thHS
x P
dHSAB
+ Z
thHSLS
x (P
dLSA
+ P
dLSB
) + T
amb
T
jLSA
= Z
thHSLS
x P
dHSAB
+ Z
thLS
x P
dLSA
+ Z
thLSLS
x P
dLSB
+ T
amb
T
jLSB
= Z
thHSLS
x P
dHSAB
+ Z
thLSLS
x P
dLSA
+ Z
thLS
x P
dLSB
+ T
amb
3.1.4 Single pulse thermal impedance definition (values according to the
PCB heatsink area)
Z
thHS
= High Side Chip Thermal Impedance Junction to Ambient
Z
thLS
= Z
thLSA
= Z
thLSB
= Low Side Chip Thermal Impedance Junction to Ambient
Z
thHSLS
= Z
thHSABLSA
= Z
thHSABLSB
= Mutual Thermal Impedance Junction to Ambient
between High Side and Low Side Chips
Z
thLSLS
= Z
thLSALSB
= Mutual Thermal Impedance Junction to Ambient between Low Side
Chips
Equation 1: pulse calculation formula
a. Calculation is valid in any dynamic operating condition. P
d
values set by user.
Z
THδ
R
TH
δ Z
THtp
1 δ–()+Þ=
where
δ t
p
T⁄=