Datasheet

Table Of Contents
Package and PCB thermal data VNH7013XP-E
16/24 Doc ID 022370 Rev 3
Figure 13. Chipset configuration
Figure 14. Auto and mutual R
thj-amb
vs PCB copper area in open box free air
condition
3.1.1 Thermal calculation in clockwise and anti-clockwise operation in
steady-state mode
("1($'5
5
WK$
5
WK%
5
WK&
5
WK$ %
5
WK$ &
5
WK% &
$IJQ
$IJQ $IJQ








 
#7
CM
OF#U!REAREFERTO0#"LAYOUT
2TH!
2TH"2TH#
2TH!"2TH!#
2TH"#
'!0'#&4
Note: Referred to double layer PCB
Table 14. Thermal calculation in clockwise and anti-clockwise operation in steady-
state mode
HS
A
HS
B
LS
A
LS
B
T
jHSAB
T
jLSA
T
jLSB
ON OFF OFF ON
P
dHSA
x R
thHS
+ P
dLSB
x R
thHSLS
+ T
amb
P
dHSA
x R
thHSLS
+
P
dLSB
x R
thLSLS
+ T
amb
P
dHSA
x R
thHSLS
+ P
dLSB
x R
thLS
+ T
amb
OFF ON ON OFF
P
dHSB
x R
thHS
+ P
dLSA
x R
thHSLS
+ T
amb
P
dHSB
x R
thHSLS
+
P
dLSA
x R
thLS
+ T
amb
P
dHSB
x R
thHSLS
+ P
dLSA
x R
thLSLS
+ T
amb