Datasheet

Package and PCB thermal data VNH5180A-E
22/31 Doc ID 17074 Rev 6
4 Package and PCB thermal data
4.1 PowerSSO-36 thermal data
Figure 15. PowerSSO-36™ PC board
Double layers: footprint
Double layers: 2cm
2
of Cu
Double layers: 8cm
2
of Cu
Note:
Board finish thickness 1.6 mm +/- 10 %, Board double layers, Board dimension 129 mm x 60 mm, Board Material FR4, Cu
thickness 0.070 mm (front and back side), Thermal vias spaced on a 1.2 mm x 1.2 mm grid, Vias pad clearance thickness
0.2 mm, Thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 0.025 mm.