Datasheet

Package and PCB thermal data VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1
24/37 Doc ID 7383 Rev 4
4.3 DPAK thermal data
Figure 44. DPAK PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area=60 mm x 60 mm, PCB
thickness=2 mm, Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8 cm2).
Figure 45. R
thj-amb
vs PCB copper area in open box free air condition
C2 (W.s/°C) 9.00E-04
C3 (W.s/°C) 3.00E-02
C4 (W.s/°C) 0.16
C5 (W.s/°C) 1000
C6 (W.s/°C) 0.5 2
Table 6. SOT-223 thermal parameter (continued)
Area/island (cm
2
)Footprint2
30
40
50
60
70
80
90
0246810
PCB CU heatsink area (cm^2)
RTH j_amb (ºC/W)