Datasheet

Package and PCB thermal data VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1
22/37 Doc ID 7383 Rev 4
4.2 SOT-223 thermal data
Figure 40. SOT-223 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area=58 mm x 58 mm, PCB
thickness=2 mm, Cu thickness=35 µm, Copper areas: 0.11 cm
2
, 1 cm
2
, 2 cm
2
).
Figure 41. R
thj-amb
vs PCB copper area in open box free air condition
C2 (W.s/°C) 9.00E-04
C3 (W.s/°C) 7.50E-03
C4 (W.s/°C) 0.045
C5 (W.s/°C) 0.35
C6 (W.s/°C) 1.05 2
Table 5. SO-8 thermal parameter (continued)
Area/island (cm
2
)Footprint2
60
70
80
90
100
110
120
130
140
00.511.522.5
Cu area (cm^2)
RTH j-amb (°C/W)