Datasheet

Package and PCB thermal data VNN7NV04, VNS7NV04, VND7NV04, VND7NV04-1
20/37 Doc ID 7383 Rev 4
4 Package and PCB thermal data
4.1 SO-8 thermal data
Figure 36. SO-8 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area=58 mm x 58 mm, PCB
thickness=2 mm, Cu thickness=35 µm, Copper areas: 0.14 cm
2
, 0.8 cm
2
, 2 cm
2
).
Figure 37. R
thj-amb
vs PCB copper area in open box free air condition
70
75
80
85
90
95
100
105
110
00.511.522.5
PCB Cu heatsink area (cm^2)
RTHj_amb (ºC/W)
SO-8 at 2 pins connected to TAB