Datasheet

Package and PCB thermal data VND5T100AJ-E
24/32 Doc ID 018513 Rev 2
4 Package and PCB thermal data
4.1 PowerSSO-12 thermal data
Figure 26. PowerSSO-12 PC board
Figure 27. R
thj-amb
vs PCB copper area in open box free air condition (one channel ON)
.
*$3*&)7
Note:
Layout condition of R
th
and Z
th
measurements (Board finish thickness 1.6 mm +/- 10 %; Board double layer; Board
dimension 77 mm x 86 mm; Board Material FR4; Cu thickness 0.070 mm (front and back side); Thermal vias separation
1.2 mm; Thermal via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm; Footprint dimension 4.1 mm x 6.5 mm)
30
35
40
45
50
55
60
65
0246810
RTHjamb
RTHjamb
GAPGC F T000124