Datasheet

Package and PCB thermal data VND5T050AK-E
24/32 Doc ID 022694 Rev. 3
4 Package and PCB thermal data
4.1 PowerSSO-24 thermal data
Figure 26. PowerSSO-24 PC board
1. Layout condition of R
th
and Z
th
measurements (board finish thickness 1.6 mm +/- 10%; board double layer;
board dimension 77x86; board Material FR4; Cu thickness 0.070mm (front and back side); thermal vias
separation 1.2 mm; thermal via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm; footprint
dimension 4.1 mm x 6.5 mm).
Figure 27. R
thj-amb
vs PCB copper area in open box free air condition (one channel
ON)
GAPGCFT00418







57+MDPE
57+MDPE
3&%&XKHDWVLQNDUHDFPA
("1($'5