Datasheet
Package and PCB thermal data VND5T016ASP-E
22/31 Doc ID 022687 Rev. 3
3 Package and PCB thermal data
3.1 PowerSO-16 thermal data
Figure 25. PowerSO-16 PC board
1. Layout condition of R
th
and Z
th
measurements (board finish thickness 1.6 mm +/- 10%; board double layer;
board dimension 77 mm x 86 mm; board material FR4; Cu thickness 70 µm (front and back side); thermal
vias separation 1.2 mm; thermal via diameter 0.3 mm +/- 0.08 mm; Cu thickness on vias 0.025 mm).
Figure 26. R
thj-amb
vs PCB copper area in open box free air condition (one channel
ON)
("1($'5
57+MBDPE&:
3&%&XKHDWVLQNDUHDFPA
57+MBDPEYV&XKHDWVLQNDUHD
57+MDPE
*$3*&)7