Datasheet

VND5E050K-E Package and PCB thermal data
Doc ID 14472 Rev 4 29/40
4.2 PowerSSO-24 thermal data
Figure 39. PowerSSO-24 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area= 77mm x 86mm, PCB thickness=1.6mm, Cu thickness=70µm (front and back side),
Copper areas: from minimum pad lay-out to 8cm
2
).
Figure 40. R
thj-amb
Vs. PCB copper area in open box free air condition (one channel
on)
30
35
40
45
50
55
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)