Datasheet

Package and PCB thermal data VND5E006ASP-E
28/37 DocID17362 Rev 6
4 Package and PCB thermal data
4.1 PowerSO-16 thermal data
Figure 35. PowerSO-16 PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4 area= 77mm x
86mm, PCB thickness=1.6mm, Cu thickness=70μm (front and back side), Copper areas: from minimum
pad lay-out to 8cm
2
).
Figure 36. R
thj-amb
vs PCB copper area in open box free air condition (one channel
ON)
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