Datasheet

VND5050J-E / VND5050K-E Package and PCB thermal data
Doc ID 12266 Rev 7 27/37
4.2 PowerSSO-24™ thermal data
Figure 35. PowerSSO-24™ PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area= 77mm x 86mm, PCB thickness=1.6mm, Cu thickness=70µm (front and back side),
Copper areas: from minimum pad lay-out to 8cm
2
).
Figure 36. R
thj-amb
vs PCB copper area in open box free air condition (one channel
on)
30
35
40
45
50
55
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)