Datasheet

VND5050AJ-E / VND5050AK-E Package and PCB thermal data
Doc ID 12272 Rev 10 27/37
4.2 PowerSSO-24™ thermal data
Figure 32. PowerSSO-24™ PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area= 77 mm x 86 mm, PCB thickness=1.6mm, Cu thickness=70 µm (front and back side),
Copper areas: from minimum pad lay-out to 8 cm
2
).
Figure 33. R
thj-amb
vs PCB copper area in open box free air condition (one channel
on)
30
35
40
45
50
55
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)