Datasheet

Package and thermal data VND5025AK-E
24/32 Doc ID 12581 Rev 11
4 Package and thermal data
4.1 PowerSSO-24™ thermal data
Figure 28. PowerSSO-24™ PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: Double layer, Thermal Vias, FR4
area = 77mm x 86mm, PCB thickness = 1.6mm, Cu thickness = 70µm (front and back side),
Copper areas: from minimum pad layout to 8cm
2
).
Figure 29. R
thj-amb
vs PCB copper area in open box free air condition (one channel
ON)
30
35
40
45
50
55
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)