Datasheet

Package thermal data VNB14NV04, VND14NV04, VND14NV04-1, VNS14NV04
20/31 Doc ID 7393 Rev 9
4.2 SO-8 thermal data
Figure 37. SO-8 PC board
(1)
1. Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness=2 mm,
Cu thickness=35 µm, Copper areas: 0.14 cm
2
, 0.6 cm
2
, 1.6 cm
2
).
Figure 38. SO-8 R
thj-amb
vs PCB copper area in open box free air condition
C4 (W.s/°C) 0.3
C5 (W.s/°C) 0.45
C6 (W.s/°C) 0.8 5
Table 5. DPAK thermal parameter (continued)
Area/island(cm
2
) Footprint 6